LD(Laser Diode)

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  • LASER DIODE DIE BONDER(SUB & Lead) SYSTEM KD260AS

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    ITEM Specification
    Overview • Rotation work station, 4 Head system by Linear motion - Submount mount on STEM and connection of Lead(L1,L2) to Submount by AuSn ribbon - AuSn Supply from Reel and AuSn Cutting by cutter
    Application • TO Header : TO56, TO60, TO38, Cooled/Uncooled package ; 10G, 25G
    Bonding Method • Ribbon Solder(AuSn) bonder
    Cycle time • About 20sec/cycle(Refer TO56/25G DML) - Optimal condition criteria (May vary depending on condition/environment)
    Bonding Accuracy • [XY] ±25㎛, [θ]±1.5° - Depend on work/chip shape and precision - May change depending on STEM, SUB, COLLET status
    Dimension  (W*D*H) • 1,900*1,100*1,800(mm), (Excepted Tower Lamp) • Weight about 1,000kg
    Utility • AC 220V, 1 Phase(50Hz/60Hz, 6.0kw) • Air: 4~6㎏f /㎠, • N2 GAS : 5kgf/㎠ more than(5L/Min) • VACUUM : -70kPa less then(120L/Min)