1. Optical device manufacturing process(TO) & Equipment
-
Inspection/Packing
Packing(Manual) -
Burn-in Test
Test & Sorting -
CAP Welding
Cap Welding -
Wire bonding
Au Wire bonder -
Die bonding(LD)
Eutectic Die bonder(LD) -
Die bonding(SUB)
Eutectic Die bonder(AuSn Plated SUB) -
CURE
Oven cure -
Die bonding(PD)
Epoxy Die bonder(Submount + mPD)
2. Semiconductor Manufacturing Process(SMD) & Equipment
-
Taping
Emboss Taping -
Test Sorter
Test & Sorter -
Trim Form
Lead Trim & Form -
Cure
Use when POWER PKG(Baking) -
Mold
Manual mold /Auto mold -
Wire Bond
Au Wire bonder -
Cure
Epoxy Process시 사용(D/B In-line가능) -
Die Bond
Eutectic, Epoxy, Solder Die bonder
3. LED Manufacturing Process & Equipment
-
Taping
Emboss Taping -
Test Sorter
Test & Sorter -
Trim Form
Lead Trim & Form -
Cure
Lead frame or Magazine Cure -
Encap
Encapsulation Dispenser -
Wire Bond
Au Wire bonder -
Cure
Lead frame or Magazine Cure -
Die Bond
Epoxy Die bonder (BLU, POWER LED 대응)
※ Can be changed according to customer process
