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LASER DIODE DIE BONDER(COC) SYSTEM KD200AC
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ITEM Specification Overview • Twin Bond head system, Simple / High Accuracy, • LD Mount on Submount(SiOB) & PD Mount on Submount(SiOB) Application • COC(Chp On Chip) Bonding Method • Eutectic bonder(Using AuSn Plated Submount) Cycle time • About 12sec/cycle(Refer COC) - Optimal condition criteria (may vary depending on condition/environment) Bonding accuracy • [XY] ±10㎛, [θ]±1.0° - Depend on work/chip shape and precision - May change depending on STEM, SUB, LD, Collet status Dimension (W*D*H) • 2,000*1,000*1,400(mm), (Excepted Tower Lamp) • Weight about 1,000kg Utility • AC 220V, 1 Phase(50Hz/60Hz, 6.0kw) • Air: 4~6㎏f /㎠, • N2 GAS : 5kgf/㎠ more than(5L/Min) • VACUUM : -70kPa less then(120L/Min)