LD(Laser Diode)

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  • LASER DIODE DIE BONDER SYSTEM KD210A

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    ITEM Specification
    Overview • Twin Bond head system, Simple / High Accuracy, • COC : LD Mount on Submount(SiOB) & PD Mount on Submount(SiOB), • LD SUB & LD Mount on STEM(TO56)
    Application • COC(Chp On Chip), TO56(STEM)
    Bonding Method • Eutectic bonder(Using AuSn Plated Submount)
    Cycle time • About 20sec/cycle(Refer TO56) , COC(24sec/cycle) - Optimal condition criteria (may vary depending on condition/environment)
    Bonding accuracy • [XY] ±15㎛, [θ]±1.0° - Depend on work/chip shape and precision - May change depending on STEM, SUB, LD, Collet status
    Dimension  (W*D*H) • 1,000*900*1,200(mm), (Excepted Tower Lamp) • Weight about 600kg
    Utility • AC 220V, 1 Phase(50Hz/60Hz, 3.0kw) • Air: 4~6㎏f /㎠, • N2 GAS : 5kgf/㎠ more than(5L/Min) • VACUUM : -70kPa less then(120L/Min)