LD(Laser Diode)

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  • EPOXY DIE BONDER SYSTEM KD210AE

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    ITEM Specification
    Overview • Epoxy Bonding of TEC, LD ASSY, TH(Thermister), mPD ASSY, and Bridge chips to STEM transported from the loader. • Part loading of Gelpak/Wafflepak tray(6pcs)
    Application • Laser diode(TO Cooled type) : 5.6Φ, 6.0Φ • Bond of TEC, LD Assy(COC), PD Assy(COC), Bridge chip …
    Bonding Method • Epoxy Dotting method
    Cycle time • About 6.0sec/cycle(Refer 1 Dot 1 Chip) - Optimal condition criteria (may vary depending on condition/environment)
    Bonding accuracy • [XY] ±15㎛, [θ]±1.5° - Depend on work/chip shape and precision - May change depending on STEM, SUB, PD, Collet status
    Dimension  (W*D*H) • 1,600*900*1,400(mm), (Excepted Tower Lamp) • Weight about 800kg
    Utility • AC 220V, 1 Phase(50Hz/60Hz, 1.0kw) • Air: 4~6㎏f /㎠, • VACUUM : -70kPa less then(120L/Min)