LD(Laser Diode)

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  • PD(Photo Diode) EPOXY DIE BONDER SYSTEM KD120AE

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    ITEM Specification
    Overview • PD Submount on TO Header and PD Mount on PD Submount • Magazine & Cassette & Carrier belt Handling type
    Application • Laser diode(TO Header : 5.6Φ, 4.6Φ, 3.3Φ)
    Bonding Method • Epoxy Dotting method
    Cycle time • About 2.0sec/cycle(Refer TO-56) - Optimal condition criteria (may vary depending on condition/environment)
    Bonding accuracy • [XY] ±25㎛, [θ]±2.5° - Depend on work/chip shape and precision - May change depending on STEM, SUB, PD, Collet status
    Dimension  (W*D*H) • 1,500*1,100*1,380(mm), (Excepted Tower Lamp) • Weight about 1,000kg
    Utility • AC 220V, 1 Phase(50Hz/60Hz, 3.0kw) • Air: 4~6㎏f /㎠, • VACUUM : -70kPa less then(120L/Min)