LD(Laser Diode)



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    ITEM Specification
    Overview • Multi function Epoxy die bonder - Rotary stage(4 Blue sheet, 4Gelpak) - Multi Work table(COC, TO CAN, BOX)
    Application • Assembly of BOX, TO CAN COC - TO Header : TO56, TO60, TO38 - BOX Package
    Bonding method Epoxy bond method(Stamp / Syringe) Eutectic bond method(Room temp ~ 500℃)
    Loader/Unloader Tray, Wafflepak, Gelpak
    Die size □200 ~□4,000㎛
    Package Assembly of Optical devices - COC, COB, STEM, BOX, Flip chip
    Parts supply (Ring & Gel pak) 4 Blue tape ring : 6inch(Φ152mm or Φ186mm) 8 Waffle pak(or Gel pak) : □2inch
    Bonding accuracy [XY] ±10㎛~±15㎛, [θ]±0.4°~±1.0°, - Depend on work/chip shape and precision
    Tact time (Ref’ 1 Dot 1 Bond) 16sec ~ 25sec - Depend on User process
    Dimension(L*W*H) 1,000*900*1,200mm, About 600kg
    Utility AC220V 50/60Hz, 3Kw, Air, N2, Vacuum