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LASER DIODE DIE BONDER SYSTEM KD2000A
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ITEM Specification Overview • Dual work station, Independent Head system(2 Head) - High throughput by Sequential Work station - Submount & LD Mount on STEM - Loader to Unloader(Customer specification meet) Application • TO Header : TO56 Bonding Method • AuSn Eutectic bonder Cycle time • About 4.6sec/cycle(Refer TO56) - Optimal condition criteria (May vary depending on condition/environment) Bonding Accuracy • [XY] ±20㎛, [θ]±1.0° - Depend on work/chip shape and precision - May change depending on STEM, SUB, LD, COLLET status Dimension (W*D*H) • 2,100*1,200*1800(mm), (Excepted Tower Lamp) • Weight about 1,500kg Utility • AC 220V, 1 Phase(50Hz/60Hz, 10.0kw) • Air: 4~6㎏f /㎠, • N2 GAS : 5kgf/㎠ more than(5L/Min) • VACUUM : -70kPa less then(120L/Min)