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LASER DIODE DIE BONDER(SUB & Lead) SYSTEM KD260AS
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ITEM Specification Overview • Rotation work station, 4 Head system by Linear motion - Submount mount on STEM and connection of Lead(L1,L2) to Submount by AuSn ribbon - AuSn Supply from Reel and AuSn Cutting by cutter Application • TO Header : TO56, TO60, TO38, Cooled/Uncooled package ; 10G, 25G Bonding Method • Ribbon Solder(AuSn) bonder Cycle time • About 20sec/cycle(Refer TO56/25G DML) - Optimal condition criteria (May vary depending on condition/environment) Bonding Accuracy • [XY] ±25㎛, [θ]±1.5° - Depend on work/chip shape and precision - May change depending on STEM, SUB, COLLET status Dimension (W*D*H) • 1,900*1,100*1,800(mm), (Excepted Tower Lamp) • Weight about 1,000kg Utility • AC 220V, 1 Phase(50Hz/60Hz, 6.0kw) • Air: 4~6㎏f /㎠, • N2 GAS : 5kgf/㎠ more than(5L/Min) • VACUUM : -70kPa less then(120L/Min)