LD(Laser Diode)

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  • EUTECTIC DIE BONDER SYSTEM KD100A

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    ITEM Specification
    Overview • Lead frame (Loader to Unloader)
    Application • Discrete(TR, DIODE, POWER PKG)
    Bonding Method • Eutectic bonding
    Cycle time • TR, Diode : 0.2sec/cycle ~ - Follow the customer process(PKG).
    Bonding Accuracy • XY ±25㎛ @ 3σ, θ ±1.5° @ 3σ (under vision) - May change depending on material
    Dimension  (W*D*H) • 1,770*1,020*1,330(mm) (Excepted Tower Lamp) • Weight about 1,200kg
    Utility • AC 220V, 1 Phase(50Hz/60Hz, 7.0kw) • Air: 4~6㎏f /㎠, • N2 GAS : 5kgf/㎠ more than(5L/Min) • VACUUM : -70kPa less then(100L/Min)