KOSEM History
2020
-
08
LD(COOLED PKG) DIE BONDER development(KD212AE) : EML
-
07
LD DIE BONDER development(KD200BX-A/B) : EML
-
01
Joined in Korea International Trade Association
-
01
Manufacturing equipment development for TO Header for 25G LD (KD260BS)
2019
-
06
Manufacturing equipment development for TO Header for 25G LD (KD260AS)
2018
-
11
High-speed LD DIE BONDER development(KD2000A)
-
10
Battery / CAN Assembly Inline system development
-
09
LD BONDER development(KD200BX)
-
08
COC BONDER development(KD200AC)
2017
-
05
TRAY형 MULTI BONDER development(KD210AE)
2016
-
01
MULTI DIE BONDER development(KD300A)
2015
-
04
Complex LD DIE BONDER development(SD250A/AE)
-
02
PD DIE BONDER development(SD120AE)
2014
-
11
Partnership as the family corporation (Andong University of Science)
-
08
LD DIE BONDER development (SD200A)
2013
-
07
Selected as the start-up growth technology development projects (Ministry of SMEs and startups)
-
04
Established Corporate Affiliated Research Institute
2012
-
12
CAMERA MODULE(ACTUATOR) process equipment development
-
06
SCREEN PRINTER development
2011
-
06
Industrial-Academic Joint Technical Development (Kumoh National Institute of Technology) - Eutectic die mount for Laser Diode (LD) Manufacturing
-
06
LASER MARK SYSTEM FOR LEADLESS PACKAGE development
-
02
LD(LASER DIODE) 2 HEAD DIE BONDER development
2010
-
08
Registered as the venture corporation
-
06
Process equipment development for producing LED TV - Connector auto solder machine by Vision and Robot
-
06
Vision system development for semiconductors
-
06
Snap cure development for semiconductor packs
-
05
Partnership with LG Innotek as the cooperative corporati
-
04
Increase of capital stock (43 million KRW)
-
04
Selected as the fostering business of the pre-tech founders from Korea Institute of Startup & Entrepreneurship - Development of a rotary dispensing system for adhesion of LED die
-
03
Registered as the cooperative corporation with KEC Ltd,.
2009
-
11
Established KOSEM (with the capital stock of 200 million KRW)