1. Optical device manufacturing process(TO) & Equipment

• Inspection/Packing

  Packing(Manual)

• Burn-in Test

  Test & Sorting

• CAP Welding

  Cap Welding

• Wire bonding

  Au Wire bonder

• Die bonding(LD)

  Eutectic Die bonder(LD)

• Die bonding(SUB)

  Eutectic Die bonder(AuSn Plated SUB)

• CURE

  Oven cure

• Die bonding(PD)

  Epoxy Die bonder(Submount + mPD)

2. Semiconductor Manufacturing Process(SMD) & Equipment

• Taping

  Emboss Taping

• Test Sorter

  Test & Sorter

• Trim Form

  Lead Trim & Form

• Cure

  Use when POWER PKG(Baking)

• Mold

  Manual mold /Auto mold

• Wire Bond

  Au Wire bonder

• Cure

  Epoxy Process시 사용(D/B In-line가능)

• Die Bond

  Eutectic, Epoxy, Solder Die bonder

3. LED Manufacturing Process & Equipment

• Taping

  Emboss Taping

• Test Sorter

  Test & Sorter

• Trim Form

  Lead Trim & Form

• Cure

  Lead frame or Magazine Cure

• Encap

  Encapsulation Dispenser

• Wire Bond

  Au Wire bonder

• Cure

  Lead frame or Magazine Cure

• Die Bond

  Epoxy Die bonder (BLU, POWER LED 대응)

※ Can be changed according to customer process

4. Equipment & Optical device(TO Header)