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LASER DIODE DIE BONDER SYSTEM KD210A
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ITEM Specification Overview • Twin Bond head system, Simple / High Accuracy, • COC : LD Mount on Submount(SiOB) & PD Mount on Submount(SiOB), • LD SUB & LD Mount on STEM(TO56) Application • COC(Chp On Chip), TO56(STEM) Bonding Method • Eutectic bonder(Using AuSn Plated Submount) Cycle time • About 20sec/cycle(Refer TO56) , COC(24sec/cycle) - Optimal condition criteria (may vary depending on condition/environment) Bonding accuracy • [XY] ±15㎛, [θ]±1.0° - Depend on work/chip shape and precision - May change depending on STEM, SUB, LD, Collet status Dimension (W*D*H) • 1,000*900*1,200(mm), (Excepted Tower Lamp) • Weight about 600kg Utility • AC 220V, 1 Phase(50Hz/60Hz, 3.0kw) • Air: 4~6㎏f /㎠, • N2 GAS : 5kgf/㎠ more than(5L/Min) • VACUUM : -70kPa less then(120L/Min)