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LASER DIODE 2HEAD DIE BONDER SYSTEM KD100A
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ITEM Specification Overview • Carrier boat type (Loader to Unloader) - Submount & LD Mount on STEM(TO Header) Application • Laser diode(LD) : TO Header TO56, TO60, TO38 • Discrete(TR, DOIDE, POWER PKG) Bonding Method • Standard : Eutectic, 2Head bonder Cycle time • Laser Diode : 2.5sec/cycle(Refer. 2 Chip bond) Bonding Accuracy • XY ±25㎛ @ 3σ, θ ±1.5° @ 3σ (under vision) - May change depending on STEM and Chip status Dimension (W*D*H) • 1,770*1,020*1,330(mm) (Excepted Tower Lamp) • Weight about 1,200kg Utility • AC 220V, 1 Phase(50Hz/60Hz, 7.0kw) • Air: 4~6㎏f /㎠, • N2 GAS : 5kgf/㎠ more than(5L/Min) • VACUUM : -70kPa less then(100L/Min)